MB-111 — MB 111

    MB-1113.5-inch Alder Lake-P board with triple display

    The MB-111 is a compact 3.5-inch embedded motherboard built around the Intel® Alder Lake-P Core i5-1235U processor. Its triple independent display capability and dense industrial I/O suit digital signage, control systems, kiosks, and other space-constrained embedded deployments.

    Highlights

    • Supports Intel® Alder Lake-P Core i5-1235U processor (10 Cores, 15W TDP)
    • 1 x DDR4 3200 MT/s SO-DIMM, up to 32GB memory
    • Triple independent display via 1 x HDMI, 1 x DP++ and 1 x LVDS (Optional: eDP)
    • 2 x Gigabit Ethernet (RJ45) ports, 6 x USB 3.0 ports, and 6 x COM ports
    • 1 x M.2 Key-M (NVMe/SATA), 1 x M.2 Key-E (Wi-Fi/BT), and 1 x M.2 Key-B (5G/4G) slot

    Description

    The MB-111 is a compact 3.5-inch embedded motherboard built around the Intel® Alder Lake-P Core i5-1235U processor. Its triple independent display capability and dense industrial I/O suit digital signage, control systems, kiosks, and other space-constrained embedded deployments.

    The board supports up to 32GB DDR4 memory, SATA and M.2 storage, dual Gigabit Ethernet, eight USB connections, six COM ports, and M.2 expansion for Wi-Fi, Bluetooth, and 5G/4G connectivity. It accepts auto-detected 12V/24V DC input and is specified for operation from 0°C to 60°C.

    Specifications

    Computing
    Processor
    Intel® Alder Lake-P Core i5-1235U processor (10 Cores, 15W TDP)
    Memory
    1 x DDR4 SO-DIMM (3200 MHz, Non-ECC), up to 32GB
    Storage
    1 x SATA Gen3 6Gbps, 1 x M.2 (Key-M 2280, PCIe x4 / SATA)
    TPM
    fTPM 2.0
    Watchdog
    Watchdog
    BIOS
    AMI UEFI BIOS
    I/O & Connectivity
    Display
    1 x HDMI Type-A (max 2048x1080@60Hz), 1 x DP++ (max 4096x2304@60Hz); 1 x LVDS/eDP Wafer + Backlight Wafer (LVDS1, VDD=3.3V; Optional: eDP, 5V/12V)
    USB
    6 x USB 3.0 Type-A, 2 x Front USB 2.0 Wafers
    LAN
    2 x GbE LAN (2 x RJ45, LAN1-2, Intel® GbE)
    COM
    6 x COM Wafers (2 x RS232, 3 x RS232/TTL, 1 x RS232/485/TTL)
    Audio
    Realtek ALC897 HDA Codec, Audio Jack + 1 x Amplifier Wafer
    Expansion
    1 x M.2 (Key-E 2230, PCIe x1 + USB 2.0, WiFi + Bluetooth); 1 x M.2 (Key-B 2242/3052, PCIe + USB 3.0/2.0, Support 5G/4G); 1 x SIM Card Wafer
    Fieldbus / IO
    1 x 8-bit GPIO Wafer (4 x GPI + 4 x GPO, 3.3V default / 5V optional)
    Others
    1 x Front Panel, 1 x I2C Touch, 2 x Fan Wafers, 1 x Buzzer, Watchdog, RTC, Clear CMOS, fTPM 2.0
    Mechanical & Power
    Power
    DC 12V/24V Auto-Detect (2.5mm DC Jack, Optional: 2P Terminal Block)
    Form Factor
    3.5-inch Standard
    Dimensions
    146 x 105mm
    Environmental
    Operating Temperature
    0°C~60°C
    Storage Temperature
    -20°C~75°C
    Relative Humidity
    Operation: 5%~95%, Storage: 5%~95%, Non-condensing
    Certifications & Software
    OS Support
    Windows 10/11 64bit, Linux